Work out deposition thickness instantly with clear inputs, formula shown and shareable results.
Deposited thickness is rate times time, but the number that matters for a real structure is step coverage: how thin the film gets on a vertical sidewall or at the bottom of a via. Sputtering gives 20-50%, CVD 60-90% and atomic layer deposition essentially 100%.
Deposition
thickness = rate x time; sidewall thickness = field thickness x step coverage
A barrier or liner that thins to nothing on a via sidewall fails to block diffusion, causing reliability failures long after electrical test passes.
It is self-limiting and conformal, depositing one atomic layer per cycle regardless of geometry — essential for high-aspect-ratio features and thin gate dielectrics.