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Bond wire length is the span from pad to lead plus the loop, with about 15% added for the arc. The number that matters electrically is inductance: roughly 1 nH per millimetre, which at gigahertz frequencies is the dominant parasitic in a wire-bonded package.
Bond wire
length approx 1.15 x sqrt(span^2 + loop^2); inductance approx 1 nH per mm
At 1 GHz, 1 nH is 6.3 ohms of reactance. A 2 mm supply bond therefore presents 12 ohms, which is why flip-chip replaced wire bonding for high-speed parts.
Shorter wires, multiple parallel bonds for supplies, down-bonds to the paddle, or moving to flip-chip where the bump inductance is tens of picohenries.