Wafer Die Per Wafer Calculator

Work out wafer die per wafer instantly with clear inputs, formula shown and shareable results.

About Wafer Die Per Wafer Calculator

Die per wafer is the usable wafer area divided by die area, minus an edge-loss term for partial die around the circumference: N = A/S - pi x D / sqrt(2S). Larger die lose proportionally more to the edge, which is one reason die size drives cost faster than area alone suggests.

Formula

Die per wafer

N = pi (D/2)^2 / S - pi D / sqrt(2 S), where S is die area and D the usable diameter

Worked example

With the default values below, Wafer Die Per Wafer Calculator returns Gross die per wafer of 1,320. Change any input above and every figure here is recalculated in your browser.

Inputs used

Wafer diameter: 300 mm
Die width: 8 mm
Die height: 6 mm
Edge exclusion: 3 mm

Results

Gross die per wafer: 1,320 die
Usable wafer area: 67,887 mm²
Die area: 48.00 mm²
Area utilisation: 93.33% %

Step by step

1Values used
2Die per wafer
3Gross die per wafer= 1,320 die
4Usable wafer area= 67,887 mm²
5Die area= 48.00 mm²
6Area utilisation= 93.33 %

Assumptions and limits

The result is derived only from the 4 inputs listed above. Anything not among them is not part of the calculation.
In particular, this calculator does not take inflation, tax, fees or charges or compounding frequency into account.
Figures are rounded for display to 2 decimal places, so totals built from several rounded parts can differ slightly from the unrounded arithmetic.

How these calculators are built and tested is described on the Methodology page. If a figure looks wrong, please report it.

Frequently Asked Questions

Why subtract an edge term?

Die straddling the wafer edge are incomplete and unusable. The correction estimates that partial ring, and it matters most for large die.

Why did the industry move to 300 mm wafers?

Area scales with the square of diameter, so a 300 mm wafer yields more than twice the die of a 200 mm one for only modestly higher processing cost per wafer.