Work out wafer die per wafer instantly with clear inputs, formula shown and shareable results.
Die per wafer is the usable wafer area divided by die area, minus an edge-loss term for partial die around the circumference: N = A/S - pi x D / sqrt(2S). Larger die lose proportionally more to the edge, which is one reason die size drives cost faster than area alone suggests.
Die per wafer
N = pi (D/2)^2 / S - pi D / sqrt(2 S), where S is die area and D the usable diameter
Die straddling the wafer edge are incomplete and unusable. The correction estimates that partial ring, and it matters most for large die.
Area scales with the square of diameter, so a 300 mm wafer yields more than twice the die of a 200 mm one for only modestly higher processing cost per wafer.