Cost Per Die Calculator

Work out cost per die instantly with clear inputs, formula shown and shareable results.

About Cost Per Die Calculator

Cost per good die is wafer cost divided by good die, plus test and packaging. Yield enters as a divisor, so it multiplies cost: at 78% yield the silicon costs 28% more per good die than the ideal, and at 50% it costs double.

Formula

Cost per die

cost = wafer cost / (gross die x yield) + test and package cost

Worked example

With the default values below, Cost Per Die Calculator returns Cost per good die of $43.89. Change any input above and every figure here is recalculated in your browser.

Inputs used

Wafer cost: 14,000
Gross die per wafer: 480 die
Die yield: 78 %
Test and package cost per die: 6.5

Results

Cost per good die: $43.89
Silicon cost per good die: $37.39
Good die per wafer: 374 die
Cost added by yield loss: $8.23

Step by step

1Values used
2Cost per die
3Cost per good die= 43.89
4Silicon cost per good die= 37.39
5Good die per wafer= 374 die
6Cost added by yield loss= 8.23

Assumptions and limits

The result is derived only from the 4 inputs listed above. Anything not among them is not part of the calculation.
In particular, this calculator does not take inflation, tax or compounding frequency into account.
Figures are rounded for display to 2 decimal places, so totals built from several rounded parts can differ slightly from the unrounded arithmetic.

How these calculators are built and tested is described on the Methodology page. If a figure looks wrong, please report it.

Frequently Asked Questions

Why is yield the biggest cost lever?

Because it divides directly into cost. A ten point yield improvement at 78% cuts silicon cost per die by about 11% with no other change.

Why is packaging sometimes the larger cost?

For small die in advanced packages — flip-chip, 2.5D interposers, HBM stacks — assembly and test can exceed the silicon cost several times over.