Work out cost per die instantly with clear inputs, formula shown and shareable results.
Cost per good die is wafer cost divided by good die, plus test and packaging. Yield enters as a divisor, so it multiplies cost: at 78% yield the silicon costs 28% more per good die than the ideal, and at 50% it costs double.
Cost per die
cost = wafer cost / (gross die x yield) + test and package cost
Because it divides directly into cost. A ten point yield improvement at 78% cuts silicon cost per die by about 11% with no other change.
For small die in advanced packages — flip-chip, 2.5D interposers, HBM stacks — assembly and test can exceed the silicon cost several times over.